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URL: https://plasma.oxinst.com/products/rie/plasmapro-100
Proper Citation: Oxford PlasmaPro 100 RIE Plasma Technology (RRID:SCR_020376)
Description: PlasmaPro 100 RIE modules deliver anisotropic dry etching. Being compatible with all wafer sizes up to 200mm, it has rapid change between wafer size, uniformity, high throughput and high precision processes, in situ chamber cleaning and end pointing, and wide temperature range electrode, from 150 degrees C to 400 degrees C.
Resource Type: instrument resource
Keywords: Oxford, Plasma Technology, Instrument, Resource equipment, Equipment, USEDit,
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